- TSOP/LOC
- Brief Introduction：
- The Lead On Chip features lead fingers that are attached directly to the surface of the chip using a double-sided adhesive tape. Since there is no die pad on the LOC lead frame, the package allows for higher density, enabling it to accommodate a larger IC chip and providing better reliability performance than traditional packages. These characteristics make LOC packaging a good choice meeting the increasing capacity and density requirements of DRAM (Dynamic Random Access Memory) designs.
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