- FC
- Brief Introduction：
- FC, also known as Flip Chip, is used to electrically and mechanically connect circuits through an appropriate number of solder balls (covered with conductive adhesive) located on its surface. This technique involves depositing tin-lead balls on the I/O PADs, then flipping the chip and heating it to combine the molten tin-lead balls with a ceramic substrate. This technology is gradually replacing the conventional wire bonding method and is becoming the mainstream of future packaging.
contact us
